描述:Molex Micro-Fit 3.0 3.0mm Single Row Right Angle Headers, 43650 Series Micro-Fit 3.0? single row right angle wire to board PCB headers with a 3.0mm pitch which form part of a high density low power connector system. These Micro-Fit 3.0? right angle header connectors have high-temperature UL 94V-0 LCP housings which can withstand high temperature 265°C IR reflow processes, the housings are polarized to prevent accidental mismating, positive-locking prevents accidental disconnects and a snap-in peg locks the header to the PCB for secure retention. The contacts of these Micro-Fit 3.0? headers are tin or gold plated (part numbers xxxx-xx01 have 15μ gold plating , xxxx-xx02 have 30μ gold plating). These Micro-Fit 3.0? right angle headers are glow-wire compatible and the through hole versions are also surface mount compatible. For mating see series 46345 Micro-Fit 3.0? single row wire to wire receptacle connectors Typical applications for these Micro-Fit 3.0? single row PCB headers include military COTS (Commercial Off The Shelf), solar power, consumer products (dryers, freezers, fridges, washing machines), data communications (routers, servers), medical and telecommunications. ### Molex Micro-Fit 3.0 系列 電壓額定值 | 250V a.c. (rms) 或 176Vd.c. | 觸點(diǎn)電阻 | 最大 10mΩ ---|---|---|--- 電流額定值(每觸點(diǎn)) | Amps | 絕緣電阻 | 最低 1000 MΩ 20//22 awg | 5 | 介電強(qiáng)度 | 1500V a.c. 24 awg | 4 | 觸點(diǎn)材料 | 鍍錫磷青銅 26 awg | 3 | 外殼材料 | 聚酯 94V-0 28 awg | 2 | 管座材料 | 高溫 LCP 30 awg | 1 | |
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